2512 Series Smaa Pure Alloy Current Sensing Precision Resistors

• Manufacturing Technology: Accumulator
• Material: Alloy
• Package: 2512
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: 2512 Series
• Application: Temperature Measurement
• Resistance Value: 0.5m to 50m
• Chip Size: 2512
• Material Code: a:Alloy
• Power Code: 3:3W
• Transport Package: Polybag, Paper Carton
• Specification: 10x10/12x12/15x15(mm)
• Origin: China
• HS Code: 8533900000
• Production Capacity: 35000/Day
• Package Size: 30.00cm * 20.00cm * 10.00cm
• Package Gross Weight: 2.000kg

Product Description

General

Chip size 2512

• Resistance value from 0.5mΩ to 50m• High power rating

• Low inductance 0.5nH to 5nH

• Low TCR

• Compatible with RoHS & Halogen free

• Compliant with AEC-Q200 standard

Application

• Switching model power supply

• Battery pack

• Notebook, personal computer

• Test Instrument

• Power Amplifie

Electrical Specifications

Type	Power Rating at 70ºC(W)	Resistance Range (mΩ)	TCR (ppm/ºC)	Resistance Tolerance	Operation Temp. Range
2512	3	0.5	±160	±1%(F)	-55ºC~+170ºC
		1	±100
		2~50	±50

Part Number Information

Type	Application	Resistance Range (mΩ)
2512	wide electrode	0.5,1
	narrow electrode	0.5,1

Type	Resistance Range (mΩ)	L (mm)	W (mm)	T (mm)	A (mm)
2512	0.5,1	6.40±0.30	3.20±0.30	0.9±0.20	1.90±0.25
	1~50	6.40±0.30	3.20±0.30	0.9±0.20	1.00±0.25

Recommended Land Patterns

Type	Resistance Range (mΩ)	A (mm)	B (mm)	C (mm)	D (mm)
2512	0.5,1	1.50	7.40	3.57	2.95
	1~50	3.18	7.40	3.57	2.11

Materials

No.	Materials	No	Materials
1	Alloy	4	Copper
2	Epoxy molding compounds	5	Nickel
3	Marking	6	Tin

Power Derating Curve

Recommended Solder Curve

Profile Feature	Pb-Free Assembly
Average Ramp-up Rate (Tsmax to Tp)	3ºC/sec Max
Preheat Temperature Min.(Tsmin) Temperature Max.(Tsmax) Time(Tsmin to Tsmax)	150ºC 200ºC 60sec~120sec
Peak Temperature(Tp)	260ºC
Time within 5ºC of actual Peak Temperature(Tp)	5sec
Melting tin time(TL)	20sec~30sec
Ramp-down Rate	6ºC/sec Max.
Time 25ºC to peak Temperature	8 min Max.

2. Wave soldering
• Reservoir Temperature: 260ºC
• Time in Reservoir: 10sec Max.

3. Hand Soldering

• Temperature: 350ºC

• Time: 5sec Max.

Product Characte ristics

Packaging
1. Tape Packaging Dimensions

2. Reel Dimensions
3. Quantity of Package

Type	Resistance Range(mΩ)	Quantity(pcs)
2512	0.5~50	3000

4.Peeling Test

Storage

•The ambient temperature shall between 5ºC~30ºC.

• The relative humidity recommended for storage is between 25%RH~60%RH.

• Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be

opened prior to use.

• The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.